| 摘要 |
PURPOSE:To deposit copper foil with high tensile strength by adding alkyl phosphate to an electroless copper plating soln. contg. a cupric salt, a complexing agent, a reducing agent, alkali hydroxide and one or more among 2,2'-dipyridyl, 2-(2-pyridyl)benzimidazole and 1,10-phenanthroline. CONSTITUTION:An electroless copper plating soln. contg. 7-12g/l copper nitrate, 20-40g/l EDTA and 2-10g/l formaldehyde is adjusted to 12.3-13pH by adding alkali hydroxide. To the plating soln. are added 25-50mg/l 2,2'-dipyridyl and 0.02-0.2ml/l alkyl phosphate. |
