| 摘要 |
PURPOSE:To obtain a package characterized by easy manufacture and excellent heat radiation, by bonding a wiring substrate and a chip carrier by a heat conducting bonding material and fixing them, and soldering the part between electrodes. CONSTITUTION:On a ceramic wiring substrate 1, an electrode 11, which corresponds to an electrode 21 for connecting ceramic chip carrier 2, is formed. A heat conducting bonding material 4, wherein a material having excellent heat conductivity is kneaded as a filler, is applied to a region 3 corresponding to the bottom surface of the central part of the ceramic chip carrier 2. In order to fix the ceramic chip carrier 2 to be mounted through the heat conducting bonding material 4, the bonding electrode 21 and the corresponding electrode 11 are aligned, bonded, and fixed. Then, soldering 25 is performed, and electric connection is accomplished. |
