| 摘要 |
PURPOSE:To enable to perform resin sealing at the same time with bonding by a method wherein conductive resin is made to fill and then hardened so that the pad electrode of a semiconductor chip and a film wiring substrate are conducted via penetration hole. CONSTITUTION:The pad electrodes 11 are formed on the semiconductor chip 1. While, a pattern electrode 21 and penetration holes 22 are formed on the film wiring substrate 2, and penetration holes 31 on a sealing resin film 3. Here, the sealing resin 3 is hardened by heating, thus provisionally fixing the chip 1 and the substrate 2 via resin 3. In other words, the conductive resin is made to fill via each of the penetration holes 22 and 31 of the bonded substrate 2 and resin 3 and heated, resulting in the complete hardening the resins 3 and 4. For the resin 4, Cu paste, Ag paste, Au paste, or acryl resin mixed with conductive particles, etc. can be used. |
