发明名称 TIN, LEAD AND TIN-LEAD ALLOY PLATING BATH
摘要 PURPOSE:To obtain homogeneous plating at a higher speed by adding a specified surfactant combined with a leveling agent to a plating bath contg. a salt of alkanesulfonic acid or alkanolsulfonic acid as a soluble complex salt which is common to bivalent tin and lead. CONSTITUTION:One or more kinds of nonionic surfactants represented by the formula and a leveling agent are added to a plating bath contg. alkanesulfonic acid or alkanolsulfonic acid and the bivalent tin salt of the acid and/or the bivalent lead salt of the acid. In the formula, A is a residue of 8-22C higher alcohol, 1-25C alkylphenol, 1-25C alkyl-beta-naphthol, 3-22C fatty acid amide, 1-25C alkoxylated phosphoric acid, sorbitan esterified with 8-22C higher fatty acid or styrenated phenol (1-4C alkyl or phenyl may be substituted for H in the phenol ring), each of R' and R'' is H or methyl, they are different from each other, and each of m and n is an integer of 1-30.
申请公布号 JPS59182986(A) 申请公布日期 1984.10.17
申请号 JP19830055190 申请日期 1983.04.01
申请人 OBATA KEIGO;DOI NOBUYASU;DAIWA KASEI KENKYUSHO:KK;ISHIHARA YAKUHIN KK 发明人 OBATA KEIGO;DOI NOBUYASU;OKUHAMA YOSHIAKI;MASAKI SEIJI;OKADA YUKIYOSHI;YOSHIMOTO MASAKAZU
分类号 C25D3/32;C25D3/30;C25D3/34;C25D3/36;C25D3/60 主分类号 C25D3/32
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