发明名称 EXPOSURE PROCESSING METHOD
摘要 PURPOSE:To prevent a fault caused by adhesion of dust, etc. generated by static electricity by making a conductive elastomer whose one end is grounded contact to a side face of a substrate, when an original picture is brought to contact exposure by sticking a picture forming material to a picture forming substrate surface. CONSTITUTION:When manufacturing a printed circuit substrate, etc., a composite plate 4 obtained by sticking a picture forming material to a picture forming substrate surface is placed between a glass plate 2 of a contact exposure use jig 1 and a plastic film 6. For instance, a strip-like body or a round rod-like body 5' of a conductive elastomer of 10<0>-10<7>OMEGAcm volume specific resistance is made to contact to one side face of the composite plate 4, and one end of an elastomer 5 or 5' is made to contact to absorbing metallic parts 3 and grounded. In this way, the film 6 is made to adhere tightly to the composite plate 4 and exposed by ultraviolet rays, and thereafter, when taking out the composite plate 4 by releasing a vacuum and separating the glass plate 2 and the film 6, it is prevented that a defective is caused in a product circuit substrate, etc. due to discharge to the human body of static electricity, and adhesion of dust and foreign matter to the glass plate 2, the film 6, etc.
申请公布号 JPS59181330(A) 申请公布日期 1984.10.15
申请号 JP19830057106 申请日期 1983.03.31
申请人 NITTO DENKI KOGYO KK 发明人 KANEKO OKIMICHI;YAMAMURA TAKASHI;HAYASHI SHIYUNICHI
分类号 G03B27/58;G03B27/18;G03B27/20;G03F1/00;G03F1/40;H01L21/027;H05K3/00 主分类号 G03B27/58
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