发明名称 Method of manufacturing a glass passivation semiconductor device
摘要 A method of manufacturing a glass passivation semiconductor device by depositing a glass passivation layer on the surface of a semiconductor junction formed on a semiconductor substrate. First laser beams which can be substantially absorbed in the glass protective material and second laser beams which can be absorbed in the semiconductor substrate are simultaneously irradiated on those portions of the semiconductor substrate on which the glass protective material is deposited, thereby providing a glass passivation layer.
申请公布号 US4476154(A) 申请公布日期 1984.10.09
申请号 US19820373731 申请日期 1982.04.30
申请人 TOKYO SHIBAURA DENKI KABUSHIKI KAISHA 发明人 IESAKA, SUSUMU;YAKUSHIZI, SHIGENORI
分类号 H01L21/316;H01L21/268;H01L21/56;(IPC1-7):B05D3/06;B05D5/12;B44C1/22;C03C15/00 主分类号 H01L21/316
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