| 摘要 |
PURPOSE:To adjust automatically the pH of a plating soln. and to stabilize plating operation by providing a pH adjusting cell on the outside of a plating cell and changing the pH in the pH adjusting cell in the direction opposite from the direction where the pH of the electrolyte in the plating cell changes. CONSTITUTION:A plating soln. 1 is circulated through a plating tank 3, a pH adjusting cell 10 and a plating cell 2 by the operation of a pump 16. A body to be plated is attached to a cathode 7 in the cell 2 and electricity is conducted from an electric power source 9 to an anode 8 and the cathode 7, by which plating is accomplished. On the other hand, a cathode 11 and an anode 12 are provided to the cell 10 and the cathode 7 and the anode 8 in the cell 2 are so set that the changing direction of the pH during plating, i.e., the direction of + or - is re versed. The pH is thus offset by the circulation of the plating soln. and the plating is stabilized without fluctuation.
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