| 摘要 |
PURPOSE:To prevent an adverse effect on solder for connection and an Si chip under the state in which the chip is used after connection, to control the chip to a shape reducing the stress of solder and to improve the reliability of a connecting section by fitting a projection into the through-hole of an insulating substrate and melting solder for connection and one for control under the state in which solder for control is opposed to the semiconductor chip. CONSTITUTION:An insulating substrate to which through-holes 7 are formed is used, and both electrodes 2, 5 are connected previously by solder 3 for connection, The solder 3 for connection solidifies to a form similar to a spherical shape at the step. Solder 10 for control is placed on electrodes 11 on the projections 14 of a jig 12, the projections 14 are fitted into the through-holes 7 of the insulating substrate 4, and solder 10 for control is opposed to a semiconductor chip 1. When heating the semiconductor chip mounting body, the solder 11 for control and the solder 3 for connection melt, and the solder 3 for connection is molded to a barrel shape by push-up force due to the surface tension of the solder 11 for control. The solder is solidified through cooling under the state, and the jig 12 is removed, thus constituting the desired semiconductor chip mounting body. |
