发明名称 |
CHIP-ARRAY-CONSTRUCTED SEMICONDUCTOR DEVICE |
摘要 |
A chip-array constructed semiconductor device comprises a plurality of semiconductor chips (1-1 to 1-4) and a mounting (5) on which the semiconductor chips are mounted. Connecting pads (2-1 to 2-6) that are common to all of the chips (1-1 to 1-4) are arranged at corresponding positions on all the chips (1-1 to 1-4) and the mounting (5) includes common conducting strips (9-1 to 9-6) commonly connected to all the chips (1-1 to 1-4). The chips (1-1 to 1-4) also include individual connecting pads (3) that are unique to the individual chips (1-1 to 1-4) and these are connected to individual conducting strips (10-1 to 10-4). The common conducting strips (9-1 to 9-6) and the individual conducting strips (10-1 to 10-4) are all formed by dividing a single conducting layer. |
申请公布号 |
EP0067677(A3) |
申请公布日期 |
1984.10.03 |
申请号 |
EP19820303014 |
申请日期 |
1982.06.10 |
申请人 |
FUJITSU LIMITED |
发明人 |
TAKEMAE, YOSHIHIRO |
分类号 |
H01L25/07;H01L21/60;H01L23/057;H01L23/13;H01L23/50;H01L23/538;H01L25/065;H01L25/18 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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