SEMICONDUCTOR HEAT SINK ASSEMBLY

摘要

A semiconductor assembly comprising a flat disc-shaped semiconductor with terminals on opposite faces with an electrically conductive heat sink in electrical and thermal contact with each face. The semiconductor device and heat sinks are enclosed and maintained under compression by a rigid frame. The heat sinks are electrically insulated from each other and from the rigid frame by an insulating bond which secures these components together. Variations in compressive pressure holding the heat sinks in facing contact with the semiconductor device is compensated by a thermally responsive element positioned between each heat sink and the rigid frame in linear alignment with each other and the semiconductor device, whereby increases in temperature will expand the thermally responsive element to increase compression forces on the assembly of heat sinks and semiconductor devices.