| 摘要 |
PURPOSE:To inhibit the formation of rust on a cutting plane and the adhesion of unnecessary matter without the formation of a bad condition at the cut part, in a process for manufacturing an enameled substrate useful as a printed circuit board having a cutting step, by applying masking to said substrate and cutting it with laser beams. CONSTITUTION:After an enamel layer 11 is baked onto a metallic material 4 prepd. by connecting a plurality of base parts 2 to a supporting frame 1 with connector parts 3, 3..., masking 12 is applied onto the layer 11 using an adhesive tape or the like. Then, the connector parts 3 are cut off as shown in the line A-A using laser beams, to blow off a part of the layer 11 together with the material 4 under a molten condition. Then, a part of the molten matter 13, e.g. these mixed product, adhere onto a cutting plane 14 to form a thin film, or said plane 14 is reformed into a black filmy state at a high temp. In addition, the molten matter 13 adheres as molten drops onto the edge part of the plane 14, the lower surface of the layer 11, the lower surface of the masking 12, etc. to form unnecessary molten matter 15. Thereafter, the molten matter 15 at the parts other than the plane 14 is removed by brushing or the like, and the masking 12 is peeled off to obtain a product 5.
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