发明名称 BONDING
摘要 PURPOSE:To improve the resistance of a hot-melt adhesive to heat and solvent and obtain a bond having optimum softness, by foaming a specified alkoxysilyl group-containing thermoplastic resin and curing it with moisture. CONSTITUTION:A least one thermoplastic resin selected from among polyamide, polyester and polyester-amide resins having an alkoxysilyl group, is foamed and cured with moisture. To accelerate hydrolysis of the thermoplastic resin, an organotin compd. such as tin octylate or dibutyltin dilaurate and an organotitanium compd. such as tetra-n-butoxy titanium are added in amounts of 0.01- 3wt%. To foam the resin, a foaming agent is used or expansion pressure of an inert gas is utilized. A surfactant may be added in an amount of 2wt% or smaller to obtain fine bubbles of the hot-melt resin.
申请公布号 JPS59172577(A) 申请公布日期 1984.09.29
申请号 JP19830048196 申请日期 1983.03.23
申请人 KAO SEKKEN KK 发明人 OKADA CHIHARU;MISHIMA MASAYUKI;UEDA YUUICHI;FUKUZAKI HIROSHI
分类号 C09J5/00;C09J5/08;C09J183/00 主分类号 C09J5/00
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