发明名称 SOLID-STATE IMAGE PICKUP DEVICE
摘要 PURPOSE:To enable to improve the characteristic of spectral sensitivity and to take a countermeasure against smear phenomenon by removing the gap between a one-layer wiring made of Al and a light shielding film by a method wherein an alumina layer is formed by oxidizing the surface of said wiring, and a said film made of Al is directly formed on this alumina layer. CONSTITUTION:The surface of the one-layer wiring 6 made of Al is exposed in oxygen atmosphere and thus oxidized, thereby forming the alumina layer 10 an insulator. Thereafter, except for the photoreceiving part, the light shielding film 9 made of Al is formed on said layer, and an insulation film 8 of SiO2, etc. to protect a smooth coating film 7 from moisture is arranged between these light shielding films 9, i.e., the light receiving part. Here, the alumina layer 10 exists between the one-layer wiring 6 and the light shielding film 9 wherein gap disappears by the formation of superposition and provided in order to insulate both, and the film thickness is sufficient 0.1mum to the utmost. Thus, the improvement of the characteristic of spectral sensitivity can be achieved, resulting in the prevention of smear phenomenon.
申请公布号 JPS59172769(A) 申请公布日期 1984.09.29
申请号 JP19830048161 申请日期 1983.03.22
申请人 MITSUBISHI DENKI KK 发明人 KIMURA MIKIHIRO
分类号 H01L27/146;H01L31/0216;H04N5/335;H04N5/359;H04N5/369 主分类号 H01L27/146
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