发明名称 GLASS TERMINAL WITH HEAT SINK FOR SEMICONDUCTOR PACKAGE AND MANUFACTURE THEREOF AND INCORPORATING JIG USED FOR SAID METHOD
摘要 PURPOSE:To fix a vertical wall as an element fixing surface for a heat sink with the high accuracy of positioning by forming a stepped wall to the upper surface of an eyelet and bringing the vertical wall of the heat sink into contact with and joining it with the stepped wall by a component in the horizontal direction of the gravity of a weight. CONSTITUTION:A lead wire 11 is studded to an eyelet 10 in an insulation manner by using a glass terminal 12. A ground lead wire is fixed to the eyelet 10 as required. The upper surface of the eyelet 10 is formed at two steps, and the stepped wall 13 of the upper surface is shaped to a vertical surface. A vertical wall 15, to which a semiconductor element is fastened, of a heat sink 14 made of copper is brought into contact with the stepped wall 13, and fixed to the upper surface of the eyelet 10 with silver solder 16.
申请公布号 JPS59172256(A) 申请公布日期 1984.09.28
申请号 JP19830046881 申请日期 1983.03.19
申请人 SHINKOU DENKI KOGYO KK 发明人 SUDOU YASUAKI
分类号 H01L23/12;H01L21/52;H01L23/36 主分类号 H01L23/12
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