| 摘要 |
PURPOSE:To provide a resin compsn. which can contain large quantities of metallic fillers without detriment to flow characteristics and gives moldings having excellent thermal and electrical conductivities, by blending a large-diameter sperical metallic filler and a small-diameter metallic filler in combination. CONSTITUTION:A resin compsn. is obtd. by blending a spherical metallic filler having a particle size of 20-1,000mu together with a metallic filler having a particle size which is 1/5 or less of the diameter of the spherical metallic filler with a resin. The small-diameter metallic filler is incorporated in the resin in such a state that the small-diameter filler is inserted into the gap between the particles of the large-diameter metallic filler so that large quantities of the metallic fillers can be uniformly dispersed in the resin, and the flow characteristics of the resin compsn. during molding as well as the thermal and electrical conductivities are improved. The resin compsn. is suitable for use in molding a heat sink or a heat-radiating plate of electronic parts such as a high power element.
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