发明名称 PHOTOCURABLE RESIN COMPOSITION
摘要 PURPOSE:The titled composition of which the surface can be cured instantaneously by irradiation with ultraviolet rays, prepared by mixing a photocurable resin with a room-temperature curing agent. CONSTITUTION:A photocurable resin (e.g., epoxy-acrylate) is mixed with a diluent monomer such as a mono- or polyfunctional (meth)acrylate, a sensitizer (e.g., benzil methyl ketal), an accelerator (e.g., cobalt naphthenate), and 0.2-5phr room-temperature curing agent (e.g., peroxide). EFFECT:Heating is not necessary, because the inside of a molding can be cured even when a filler or a colorant is contained. A cured product having small internal residual stress can be obtained. USE:Sealing material for electronic parts, elements, etc., surface-coating material, bonding material, etc.
申请公布号 JPS59168033(A) 申请公布日期 1984.09.21
申请号 JP19830043353 申请日期 1983.03.15
申请人 MATSUSHITA DENKO KK 发明人 FUKUSHI HIDEMI;KONDOU SANENORI
分类号 C08G81/00;C08G85/00 主分类号 C08G81/00
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