| 摘要 |
PURPOSE:To accurately polish one side of each of two wafers as a mirror surface and enhance the speed of the machining, by using a vacuum suction unit to turn the wafers as planets by a carrier while sucking the wafers on, to polish them between rotary surface plates. CONSTITUTION:When wafers 17, 18 are processed by plates 15, 16 of high flatness, the porous part 11 of a vacuum suction unit 10 is elastically deformed to push out internal gas from the part to make its internal pressure neagative to suck the wafers on the flat surfaces of the suction unit. The wafers 17, 18 are inserted into the through hole 26 of a carrier 2 and pushed on each other by an upper and a lower rotary surface plates 3, 4 having non-woven fabrics 5. The carrier 2 is rotated as a planet while a machining liquid containing free abrasive grains is supplied, so that one side of each wafer is polished as a mirror surface. After that, the wafers 17, 18 are put in a vacuum container to separate the wafers from the vacuum suction unit 10. According to this constitution, the wafers are accurately finished as mirror surfaces and the speed and efficiency of the machining are promoted. |
