| 摘要 |
PURPOSE:To prevent the adverse influence caused by heat by a method wherein, when the resin burr adhered to the external part of a lead is going to be removed by performing a brushing, said brushing is conducted while a low temperature gas is being jetted on the part where resin burr is stuck. CONSTITUTION:A brush 11a, which is rotated in a vertically supported position to a brush member by a rotating shaft 12, is arranged in such a manner that a brushing can be performed on the part where resin burr is stuck on the outer leads 2, 2... of a semiconductor device. The semiconductor device performs a reciprocatory movement horizontally in the direction as shown by arrows in the diagram. Also, a cold air cylinder 13, provided pointing to the brushing part of a lead 2, is connected to a cold air source 14, and cold gas of -10--30 deg.C or thereabout, for example, is jetted out from the cool air cylinder 13. |
