发明名称 THERMAL EQUILIBRIUM TYPE SOLDERING DEVICE
摘要 PURPOSE:To prevent generation of thermal stress and strain and to obtain a product having good quality by soldering a material to be soldered without collapsing the thermal equil. state thereof. CONSTITUTION:A material to be soldered is carried by a conveyor 5 into a flux tank 1, where a flux is coated thereon, then the material enters the inside of a thermal equil. tank 6 constituted of an atmosphere furnace or the like where the material is preheated to about the temp. of the solder in a soldering tank disposed in the tank 6. The material heated to a set soldering temp. is dipped in the soldering tank and is thus subjected to soldering. The material is thereafter moved into a cooling tank 7 constituted of an atmosphere furnace set with a gentle temp. gradient, and is slowly cooled without coolapsing the thermal equil. state, and thereafter the material is discharged from the furnace.
申请公布号 JPS59156569(A) 申请公布日期 1984.09.05
申请号 JP19830030559 申请日期 1983.02.25
申请人 MITSUBISHI DENKI KK 发明人 HAMADA MASAKAZU
分类号 B23K1/08;(IPC1-7):B23K1/08 主分类号 B23K1/08
代理机构 代理人
主权项
地址