| 摘要 |
PCT No. PCT/JP80/00107 Sec. 371 Date Jan. 18, 1981 Sec. 102(e) Date Jan. 12, 1981 PCT Filed May 17, 1980 PCT Pub. No. WO80/02623 PCT Pub. Date Nov. 27, 1980.A process for producing a semiconductor device and for minimizing the effects of implanted boron on a silicon dioxide insulator layer is presented. The process includes the using of a silicon nitride film having windows to define the regions of a semiconductor device, such as a bipolar transistor and isolation regions wherein the isolation region and the semiconductor regions are formed by thermal diffusion of boron using a self-alignment production process. A first mask of the silicon nitride film is formed by patterning its in the form of an endless stripe so that the influence of the reaction between the boron and silicon nitride upon the silicon nitride film is considerably reduced as compared with the conventional process. As a result, the problem of low production yield and low reliability of the semiconductor device is solved. |
