| 摘要 |
PURPOSE:To prevent undesirable paste padding from happening by a method wherein, when a semiconductor element is fixed on a radiating plate not plated with a metal using conductive paste, the backside of an element is coated with conductive paste for fixing element using multiple members including rollers. CONSTITUTION:A semiconductor element 5 is fixed on a radiating plate 7 not plated with a metal using silver paste 4 and the element 5 is connected to an externally protruding lead 8 using a metallic fine wire 9 while the element 5 and the fine wire 9 are molded together using a resin 10. At this time, the backside of the elements 5 is coated with paste 4 comforming to the procedures mentioned as follows not to cause any padding of the paste 4 coated on the backside of the element 5 even if the paste 4 is scrubbed. In other words, the paste 4 containing metallic powder, resin and solvent is mixed and kneaded by the first and second rollers 1 and 2 to be shifted on the third roller 3 with thickness of around 10mum. Later the element 5 attracted by a collet 6 is made abut against the roller 3 to shift the paste 4 on to the backside of the element 5. |
