| 摘要 |
PURPOSE:To improve the accuracy of the positioning during the manufacturing process by a method wherein a positioning mark is scanned by an electron beam and a produced characteristic X-ray is detected and the positioning is performed according to this detected signal. CONSTITUTION:An L-shape positioning mark 5, made of platinum-silicon alloy, is formed on the surface of a semiconductor substrate 1 and a resist film 4 is formed so as to cover the surface and the mark 5. When the positioning mark 5 is scanned by an electron beam 3, a characteristic X-ray of Pt is produced from the positioning mark 5 and the X-ray signal can be detected. The characteristic X-ray signal of Pt can be securely detected if the thickness of the resist film 4, formed over the positioning mark 5, is not more than about 2mum. In other words, the characteristic X-ray is securely produced from the positioning mark 5 made of Pt-Si if the electron beam can penetrate. Therefore, even if the positioning mark 5 is covered by the resist film 4, the electron beam, which is strong enough to expose the resist film 4, can produce the positioning signal sufficiently. |
