发明名称 ALUMINUM EVAPORATED LEAD FRAME
摘要 PURPOSE:To upgrade the anticorrosion of an aluminum film by a method wherein the crystal orienting property of an aluminum evaporated film is set at more than a specified value. CONSTITUTION:The film formation of an aluminum film is performed while the rate of existence of aluminum ions is controlled according to ion plating and cluster ion beam methods and the orienting degree of the film to the 111 face is set at more than 70%. Through these procedures, the corrosion resistance of the aluminum film can be remarkably improved, thereby enabling to perform a wire-bonding using aluminum wires even in a plastic package IC.
申请公布号 JPS59145551(A) 申请公布日期 1984.08.21
申请号 JP19830020185 申请日期 1983.02.09
申请人 HITACHI KINZOKU KK 发明人 KAWAI TETSUO;SAKAKIBARA MASAHIKO;HARA HISAO
分类号 C23C14/14;C30B28/12;C30B29/02;H01L23/495;H01L23/50 主分类号 C23C14/14
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