| 摘要 |
PURPOSE:To obtain a Cu alloy provided with various characteristics suitable for use as the lead material of a semiconductor apparatus by adding a very small amount of P, As, Cr, Sn, Mg or Mn to a Cu-Ni-Si alloy having a specified ratio in the composition. CONSTITUTION:This Cu alloy is obtd. by adding, by weight, 0.001-2.0% in total of one or more among 0.001-0.1% P, 0.001-0.1% As, 0.01-1.0% Cr, 0.01-1.0% Sn, 0.01-1.0% Mg and 0.01-1.0% Mn and one or more among 0.001-0.1% Sb, 0.01-1.0% Fe, 0.01-1.0% Co, 0.01-1.0% Al, 0.01-1.0% Ti, 0.01-1.0% Zr, 0.01-1.0% Be and 0.01-1.0% Zn as secondary components to an alloy consisting of 0.4-1.0% Ni, 0.1-0.3% Si, <=10ppm O2 and the balance Cu with inevitable impurities. The resulting alloy satisfies all of characteristics required by a lead material such as heat radiating properties, heat resistance, strength, solderability and adhesive strength to plating.
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