发明名称 Method of making pressure point contact system
摘要 A system of disassemblable contact junctions for prefabricated conductor paths, such as may be provided on printing wiring boards, flexible printed cables or the like, Each contact junction includes a pressure point contact attached to an associated conductor path. Both the pressure point contact and the opposed conductor path are coated with solder or equivalent. Rigid blocks on opposite sides of the two sets of circuit conductors with an interspersed pad of compliant material, such as rubber, hold the assembly together under substantial pressure. Each of the pressure point contacts is formed with a ridge along the contacting face which, under the pressure developed by the assembly, penetrates through the oxide surfaces of the contacting solder layers, breaking the oxide surfaces and forming a gas tight electrical connection provided by the cold flow of the solder. The assembly can be readily disassembled and rejoined in case repairs are needed or it is desired to substitute connections to another set of prefabricated conductor paths. The individual contacts may be formed by etching a sheet of copper alloy to develop a comb bearing the contacts, chemically milling the pressure point contact elements along the end of the comb to form the raised ridges on the base portions, coating and attaching the contacts with solder on a series of prefabricated conductors while temporarily mounting them in position by means of a soldering tool, and then breaking off the comb to leave the contacts in the desired positions.
申请公布号 US4466184(A) 申请公布日期 1984.08.21
申请号 US19820445441 申请日期 1982.11.29
申请人 GENERAL DYNAMICS, POMONA DIVISION 发明人 CUNEO, EDWARD A.;MONTEI, HAROLD R.;OLIVIERI, MICHAEL
分类号 H01R4/02;H01R12/62;H01R13/22;H05K3/32;H05K3/36;H05K3/40;(IPC1-7):H05K3/36 主分类号 H01R4/02
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