| 摘要 |
PURPOSE:To reduce the number of manufacturing steps by sealing with protecting resin a semiconductor chip and soldering an electronic part only for good chip and part inspected in an intermediate characteristic inspection. CONSTITUTION:A semiconductor chip 3 is bonded with conductive bonding resin 4 on a die pad of wiring conductors 2 on an insulating substrate 1, an electronic circuit part 7 is bonded with the resin 4 on the conductors 2, and thermally cured. Subsequently, the chip 3 is wire bonded via fine metal wirings 3 to the conductors 2, and an intermediate characteristic inspection is achieved. The good chip 3 is covered with protective resin 5 at the part of the chip 3, thermally cured, and the part 7 is soldered to the conductors 2. The improper chip is replaced by the proper chip and similarly treated. In this manner, the number of manufacturing steps can be reduced, thereby improving the yield of the products. |
