| 摘要 |
The mounting method consists in depositing, on the substrate 3 carrying the conducting tracks 4, a layer 6 of insulating substance having windows 7 uncovering the connection areas 5 of the tracks 4. Next, a layer 8 of solder material is deposited at the bottom of the windows. All that then remains to be done is to lay the board 1 on the substrate 3 held horizontally, the contact studs 2 being engaged in the windows 7, and to melt the solder. The board 1 will then float freely on the solder masses in order to adopt an optimum position. After the solder has solidified, a perfect electrical and metallic connection exists between the contact studs 2 and the conducting tracks 4. <IMAGE>
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