| 发明名称 |
PROCESS OF FORMING A PLATED WIREPACK WITH ABRASIVE PARTICLES ONLY IN THE CUTTING SURFACE WITH A CONTROLLED KERF |
| 摘要 |
<p>A narrow wire blade with abrasive particles plated within a longitudinally-extending, plated cutting portion that extends from only one side of a wire core and has parallel side walls spaced by a controlled width.</p> |
| 申请公布号 |
CA1172453(A) |
申请公布日期 |
1984.08.14 |
| 申请号 |
CA19820394614 |
申请日期 |
1982.01.21 |
| 申请人 |
CRYSTAL SYSTEMS INC. |
发明人 |
SMITH, MAYNARD B.;SCHMID, FREDERICK;KHATTAK, CHANDRA P. |
| 分类号 |
B23D61/18;B24D18/00;(IPC1-7):B28D1/06 |
主分类号 |
B23D61/18 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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