| 摘要 |
PURPOSE:To obtain a LSI package, cost thereof is low, by separating a lead and an outer frame under the state in which a dummy lead is enclosed in a sealing body. CONSTITUTION:A lead frame 15 is made of a sheet consisting of Kovar or a 42 alloy or the like approximating to a thermal expansion coefficient of silicon, and each lead 8 extends toward the inside of a rectangular frame from each side of a rim 16 composed of the frame. Recessed sections 19 are formed to dummy leads 18, and broken simply when external force is applied. The recessed sections 19 are positioned on the edge sections of the outer circumferences of first and second packages 1, 3. A support plate 4 on which a heat sink 14 is fixed is fastened to the second package 3 by using a reinforcing plate 6 and low melting- point frit glass. A pellet 11 is fixed to the support plate 4 through an Au layer. The first package 1 is superposed on the second package 3 through the low melting-point glass frit, and sealed integrally in an airtight manner through heating and melting. The rim section is broken from the recessed sections 19 of the dummy leads 18, thus obtaining a LSI package. |
