| 摘要 |
PURPOSE:To enable the wire bonding without an adhesive by making the wire bonding with fixing an IC to a circuit board by a vacuum chuck. CONSTITUTION:The substrate comprises the structure in which a flat part 4 smaller than an IC1 is arranged on the circuit board 2 and a through hole 5 is opened in the center of said flat part 4. The IC1 is put on the board 2 and these are put on a vacuum chuck 6 leaving as they are to be attracted in vacuum thereby fixing the IC1 to the board 2. After that, wire bonding is made and after completion of bonding, the vacuum condition is released to move the circuit and the next molding process is started. At this time, as the IC1 is not detached or displaced by some impact, the molding can be done. |
