| 摘要 |
PURPOSE:To fully bond a deposit to a polymeric film by a method wherein, first, a primer layer consisting of thermosetting resin is formed in semi-set state onto the surface of the polymeric film; secondly, metal film is spread onto the primer layer by physical vapor deposition and finally the semi-set thermosetting resin primer layer is fully set. CONSTITUTION:First, a primer layer in semi-set state is obtained by applying, for example, epoxy resin primer by 3mum thickness to a polyimide film with a thickness of 12.5mum. Secondly, copper is deposited by 0.1mum thickness onto the primer layer with a sputtering device in the state that the film temperature is kept below 100 deg.C and, after that, further deposited until the resultant thickness of the copper deposit reaches 0.3mum while raising the film temperature up to 200 deg.C. After that, copper plating is applied by wet process onto the copper- deposited surface until the total copper thickness reaches 5mum. Thus, the complete bonding of the copper deposit to the film. In addition, because the above- mentioned process is simple, the deterioration of the film is eliminated. |
