| 摘要 |
PURPOSE:To contrive to enhance precision of positioning of a chip inside of a reticle wafer, and to enhance a throughput by a method wherein an arithmetic and memory means to operate the relative position and precision of orthogonality of X-Y axes of every chip is provided, and the exposing position of every chip is automatically corrected. CONSTITUTION:A wafer 3 exposed on the wafer is used to be put on an X-Y stage. Because the wafer 3 put on the X-Y stage is rotated and has positional discrepancy between the reticle center and the wafter center, the coordinates of target marks in chips 8, 9 are measured, and the whole of the wafer is corrected. As the correcting items, the rotated angle of the wafer, the expansion and contraction quantity and slippage of relative positions between the reticle wafer are measured. After correction is finished, that if the wafer thereof is the first wafer or not is checked, and when it is the first wafer, it is transferred to the chip alignment process, and positional discrepancy (DELTAXi, DELTAYj) quantities of the coordinates of the center of each chip is stored every chip. After completion of measurement, the next wafer is put on the X-Y stage, and after wafer alignment is performed, the measured DELTAXi, DELTAYj quantities are added as the correcting items to the exposure objective coordinates of every chip, and exposure is performed. |
