| 摘要 |
PURPOSE:To increase the amount of liquid reaching a wafer by restraining liquid evaporation and reduce the used amount by closing the space in the periphery of the wafer, thus keeping the inside at over the atmospheric pressure, and then spraying. CONSTITUTION:When a wafer 11 is placed on a chuck 5, a cup 7 rises and is closed by a lid 4, thus being sealed with rings 12-14. N2 of approx. 1.5atm is introduced 17 to the closed space 15, the wafer is spinned by means of a motor 1, and developer and rinsing liquid mixed with N2 gas of approx. 5atm are sprayed out of nozzles 2 and 3. The periphery of the wafer is kept at about 1.3atm by adjusting a valve 18, and the wafer is developed, rinsed and dried. After drying, N2 introduction is stopped, the gas is exhausted 10, and the wafer 11 is taken out. This constitution makes processing time for development and rinsing shorten respectively, and accordingly the used amount of the liquid is much reduced. |
