TRANSFER LAMINATION OF VAPOR DEPOSITED FOILS METHOD AND PRODUCT

摘要

A copper-clad laminate having special utility in printed circuit board production because of its extremely smooth and virtually pinhole-free surface is made by vapor depositing a copper film on a layer of silica on an aluminum carrier sheet, electrodepositing a layer of copper on the film to form a foil, bonding the foil to a substrate and finally stripping the foil and substrate laminate from the silica-coated carrier sheet.