| 摘要 |
PURPOSE:To form a metallic pattern on an insulating substrate by an electroless plating method without carrying out an etching stage by forming a desired pattern on the substrate using a soluble resist, coating the whole surface with catalytic nuclei, and removing the resist and the catalytic nuclei on the resist with a solvent. CONSTITUTION:A desired pattern exposing only parts of an insulating substrate 1 to be subjected to electroless plating is formed on the substrate 1 using a resist 2 soluble in a solvent. The substrate 1 is immersed in a catalyzer-accelerator bath to coat the whole surface with catalytic nuclei 3. The resist 2 and the nuclei 3 on the resist 2 are removed with said solvent, and only the nuclei 3 on the exposed parts of the substrate 1 are left. A metallic film pattern 4 is then formed by an electroless plating method using the catalytic nuclei 3 as nuclei. |
