发明名称 MOISTURE SENSITIVE MATERIAL
摘要 <p>PURPOSE:To obtain a long-life moisture sensitive material dispensing with a heater with a low electric resistance by firing a composition containing an organic silicon compound polymer and an alkali metal compound to achieve the coating and connection of an alkali metal compound with an amorphous SiO2. CONSTITUTION:A composition is produced which contains 10-85wt% of an initial polymer or methyl phenylsilicon, epoxy resin modified methylsilicon and the like and 3-50wt% of a compound such as oxide, carbonate, hydroxide of alkali metal and additives arranged to secure a film forming property, a promotion of drying and hardening and the like required for use as moixture sensitive material. The composition 3 is applied on an alumina substrate 1 on which a comb-shaped electrode 2 was previously printed with a Pt-Pd alloy paste or the like and a lead wire 4 is mounted thereto and following a prefiring thereof at about 80 deg.C, fired above 500 deg.C for 30min. to form a moisture sensitive sensor. The composition thus fired, namely, a moisture sensitive material 3 is limited in the changes of moisture sensitive characteristic due to aging and higher in the response speed. Thus, the sensor is obtained with the resistance value hard to vary free from dew formation on the surface thereof.</p>
申请公布号 JPS59132352(A) 申请公布日期 1984.07.30
申请号 JP19830006882 申请日期 1983.01.19
申请人 MITSUBISHI DENKI KK 发明人 UCHIKAWA HIDEFUSA
分类号 C09K3/00;G01N27/12;H01C7/00 主分类号 C09K3/00
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