发明名称 METHOD OF PRODUCING FLATTENED NONCONDUCTIVE LAYER BY USING CONDUCTIVE METAL
摘要 <p>By depositing metal in an inert gas at a pressure of substantially 30 millitorr on an insulating substrate a metal layer is produced which is conducting across its thickness but substantially insulating in transverse directions. If a second metal layer is deposited according to the method of European patent application 8 330 1676.9 partially overlapping this first layer, the overlap portions are similarly insulating in transverse directions, while the non-overlapping portions are conducting. This arrangement has applications to the manufacture, inter alia, of Josephson junction devices. …<??>Figure 6 is a drawing of a scanning electron micrograph of such a composite layer. In the non-overlapping portion of the metal layer comprises a plurality of micro-crystals 24, physically and electrically connected to each other, and forming a homogeneous metal layer. In the overlapping portion the micro-crystals form islands 25, separated by insulating voids 26 which extend vertically completely through the layer, causing it to be transversely non-conducting. …<??>In the examples given in the specification the metals used are lead and lead alloys, and the inert gas is argon. Copper and aluminium are also mentioned as suitable metals.</p>
申请公布号 JPS59130488(A) 申请公布日期 1984.07.27
申请号 JP19830177161 申请日期 1983.09.27
申请人 SPERRY RAND CORP 发明人 PEETAA RAN CHIYAN YAN
分类号 H01L21/3205;C23C14/24;H01L23/52;H01L39/22;H01L39/24 主分类号 H01L21/3205
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