发明名称 METHOD FOR MONITORING ANISOTROPY OF PLASMA ETCHING
摘要 PURPOSE:To make the anisotropy of plasma etching higher accurate by detecting the luminous intensity of given gas plasma, and automatically changing etching conditions according to the variation of intensity. CONSTITUTION:The luminous intensity of plasma generated by reaction in a container 11 is ld out by means of an optical fiber 17, photoelectrically converted 22 and amplified 23 through a filter 21 of a specific wavelength, and then recorded 24. The variation of photo intensity is calculated, and, by corresponding thereto 25, the instruction based on the ratio of SiCl4 to Cl2+BCl2 and the programs such as vacuum degrees and electric power is given, thus controlling valves 18 and 19 and then keeping proper conditions. When complete anisotropic etching is performed, a recorder 24 image-draws the polygonal line (b) of luminous intensity-time passage, and the luminous intensity F immediately before starting becomes equal to the intensity I immediately after finishing, and the intensity G at the starting point becomes equal to the intensity H at the finishing point. In this case, side etching is hardly performed, and anisotropic etching is performed with good accuracy. Thereby, the etched are of an Al film 3 becomes always constant during reaction.
申请公布号 JPS59129428(A) 申请公布日期 1984.07.25
申请号 JP19830005096 申请日期 1983.01.13
申请人 FUJITSU KK 发明人 MARUYAMA TAKASHI
分类号 H01L21/302;H01L21/3065;(IPC1-7):01L21/302 主分类号 H01L21/302
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