| 摘要 |
PURPOSE:To remove mismatching, and to contrive to reduce cost of the titled device by a method wherein some fixed gap is provided in series to a part of a circuit constructing input/output matching circuits, and a chip type capacitor having electrodes separated by width nearly the same with the gap thereof is connected directly between both the edges of the gap. CONSTITUTION:A chip type capacitor 14 formed extending over both the edges of a gap G between circuit patterns 2, 3 formed on a dielectric substrate 1, and having electrodes 8, 8 separated by width nearly the same with the gap thereof is directly soldered or pasted on the circuit patterns. Accordingly, removal of circuit mismatching, reduction of manufacturing cost can be attained according to the mounting method of the chip type capacitor. |
