| 摘要 |
<p>PURPOSE:To improve the external appearance yield of a hybrid integrated circuit device by bonding powder resin on an insulating substrate, heating it to fuse the bonded resin and uniformly coating the resin on the periphery of the substrate, thereby reducing improper external appearance and dimensions. CONSTITUTION:An insulating substrate 22 is suspended in a sheathed resin bonding tank 3 in such a manner that the leads 21 of a hybrid integrated circuit are disposed upside in a spraying tank 1. Then, high pressure air 7 is blowed from an injection hole 6 which is disposed at the bottom of a powder tank 5 in which silicon 5 is filled. Then, the silicon 5 in the powder tank is introduced into the sheathing resin bonding tank 3 in the tank 3 as sprayed state through a gauze 4 of fine mesh. At this time, the temperature in the tank 3 is heated at 100-150 deg.C. Then, the silicon is uniformly bonded in spray state around the substrate 22. When sufficiently bonded, the hybrid integrated circuit is removed and cured. Then, the sheathed resin of silicon 5 is uniformly formed as a file around the substrate of the integrated circuit.</p> |
