| 摘要 |
PURPOSE:To clean the surface of a wafer uniformly and improve the cleansing quality of the wafer and eliminate the cleansing defect by making a cleansing brush rotate and at the same time move reciprocally along the surface of the wafer. CONSTITUTION:A brush 11 which has a flocking length longer than the diameter of a wafer 12 rotates to the direction of an arrow C and at the same time moves reciprocally to the direction of an arrow D and a disc 13 rotates to the direction of an arrow E with a shaft 14. A plurality of the wafers 12 are fixed to the upper surface of the disc 13 and revolved in pure water or in solvent by the rotation of the disc 13 and at the same time the brush 11, rotating and moving reciprocally, touches the upper surface of the wafer 12. As a result, the tips of the planted flocks of the brush 11 snake on the concentric circles of the disc 13 so that the surface of the wafer is rubbed uniformly and the lumping of the tips of the brush flocking is avoided. |
