发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To make the heat radiating property of a pellet excellent and to facilitate its manufacture, by surrounding a cavity part, wherein the pellet is enclosed, by a base part formed by a resin and a heat sink having an airtight sealing part and a heat radiating fin. CONSTITUTION:An IC package 21 is provided with a base part 22, which is formed by a resin mold as a unitary body. A part of a heat sink 27 is exposed to a cavity part 23 in the base part 22. A heat radiating fin 29 is coupled to the outer surface of a main body 28, which is extruded to the outer air. A pellet 30 is bonded to the exposed surface of the heat sink 27 at the cavity part 23, and electrically connected to inner leads 25 through bonding wires 31. An airtight sealing part 32 is formed in the cavity part 23 by filling the cavity part with a resin by using potting, transfer mold, or the like.
申请公布号 JPS59117244(A) 申请公布日期 1984.07.06
申请号 JP19820226326 申请日期 1982.12.24
申请人 HITACHI OUME DENSHI KK;HITACHI SEISAKUSHO KK 发明人 YOSHIDA HISASHI;OKIKAWA SUSUMU
分类号 H01L23/12;H01L23/28;H01L23/367 主分类号 H01L23/12
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