| 摘要 |
PURPOSE:To enable to mount a solid state image sensor without damaging the surface of the sensor in an enclosure which has a mount for mounting the sensor by providing a hole for attracting an element smaller than the sensor on the bottom of the mount. CONSTITUTION:An enclosure for a semiconductor element is composed of a ceramic package 1 and an optical window material 5 for covering the surface, and a hole 7 for attracting an element is opened at the center of a mount 6 for the package 1. The hole 7 is not necessarily formed in a circular shape, and may not be formed at the center of the mount 6, but the size of the hole is formed in such a manner to be smaller than the element 3 and in size capable of inserting vacuum pincers. The enclosure is thus constructed, the pincers are first inserted from the lower surface of the hole 7, the back surface of the element 3 is attracted, and the element 3 is secured with an adhesive to the mount 6 while pulling the element 3 to the mount 6. Subsequently, the electrodes of the element are connected to the electrodes of the package 1 via bonding wirings 4, and the hole 7 is blocked with low melting point glass. In this manner, the damage of the element 3 is avoided. |
