| 摘要 |
PURPOSE:To reduce man-hours by attaching a tape obtained by applying or attaching bonding agent on a hard plastic film to the element forming surface of wafer, cutting the film with a press and thereafter grinding the rear side of wafer while the film is attached to a base. CONSTITUTION:A bonding resin 52 is applied or attached to a hard film 5 and the film is wound like a roll through a release paper 25. The element forming surface of wafer 13 is set in the tape side and is held between the release papers 25 and these are pressed by the roller. The wafer is punched in the size just suitable for grinding, the film is set in the side of base 24, it is then attracted, and the wafer is ground up to the specified thickness with a blade 31. According to this method, the wafer can be punched automatically to the optimum size since the film is hard. Moreover, if crack or missing is generated on the wafer, the porous layer 23 at the center of grinding base is not exposed, it is attracted perfectly. When a small size wafer is previously cut in accordance with a large size wafer, it can be ground and base replacement is not required. With such constitution, man-hours for cutting can be reduced.
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