| 摘要 |
PURPOSE:To improve the suitability of wiring of a high m.p. metal such as W or Mo to chemical plating by treating a wet ceramic board having the wiring formed by metallizing with an alkaline aqueous soln. contg. a water soluble Pd salt, a specified Pd complexing agent and a pH adjusting agent as essential components to activate the wiring. CONSTITUTION:Wiring is formed on a clay board by printing with ink contg. a high m.p. metal such as W or Mo, and the board is calcined at a high temp. The resulting W or Mo wiring is chemically plated with an electrically conductive metal so as to reduce the electric resistance. To activate the surface of the wiring before chemical plating, the wiring is treated with an activating soln. contg. a water soluble Pd salt such as PdC2, Pd(NO3)2 or PdSO4, a Pd complexing agent represented by formula I (where n is an integer of 2-6) such as triethylenetetramine, and a pH adjusting agent such as NaOH. The activating soln. has 10-14.5pH, 10<-6>-10<-3>mol PD concn., and 2-10,000 molar concn. ratio of the complexing agent/Pd. |
