| 摘要 |
PURPOSE:To enable to control film thickness of a resist to the desired thickness having favorable reproducibility by a method wherein the resist is applied on a substrate in the condition holding the application atmospheric temperature to 24 deg.C or less using the spinner method. CONSTITUTION:After the surface of a glass substrate is rinsed using a neutral detergent and an organic solvent, the neutral degergent and the organic solvent are removed using distilled water, and the substrate is dried according to blowing of nitrogen. After then, the substrate is heat-treated in air at 500 deg.C for 1hr, for example. Then after the substrate is cooled up to the room temperature, a resist is applied on the glass substrate thereof using the spinner method within about 30min. At this time, when application is performed holding the resist application atmospheric temperature to 24 deg.C or less, a uniform resist film having no irregularity of application can be obtained. |
