| 摘要 |
PURPOSE:To prevent a Pd decreasing phenomenon in Ag-PD conductor from occuring by a method wherein a reaction layer of silver and tin is formed on a conductor before soldering operation is started. CONSTITUTION:Sn alloy foil and particles with much Sn content is placed on an Ag-Pd conductor 2 inside dams 3 on the surface of the Ag-Pd conductor 2 on a package 1 and then they are heated and melted to separate Ag in the Ag-Pd conductor on Sn layer forming an Ag-Sn reaction layer 7. Next a semiconductor pellet 4 is placed with the bottom up to locate solder bumps 5 on the Ag-Sn reaction layer 7 and then a solder part 6 is formed using Pb rich soldering material to solder the solder bumps 5 by solder part 6 bonding the pellet 4 to the package 1. When the Pb rich soldering material is heated and melted, Pd content in the Ag-Pd conductor is going to enter into semiconductor material but intercepted by the Ag-Sn reaction layer 7 having no influence upon the Ag-Pd content at all. Through these procedures, any corrosion of the conductor 2 may be prevented from occuring. |
