Thermoplastic, urethane-containing, compound with a pendent epoxy group, heat-curable composition containing it and process for adhesively bonding two substrates.

摘要

A thermoplastic, urethane-containing, compound with a pendent epoxy group. According to the invention this compound is the product of the reaction of an epoxy resin containing more than one and preferably two hydroxyl groups and of a diol with ends blocked by a polyisocyanate, preferably a diisocyanate. The compound is preferably formed in the presence of an epoxy crosslinking agent which reacts to heat. The invention applies especially to adhesives, to sealants or to coatings which can be cured by heat.