| 摘要 |
PURPOSE:To reduce the outer dimension of a package for sealing a semiconductor chip by a method wherein a plurality of leads are arranged in non-parallel state with one another along the side surface of the package, and tips of leads are arranged in parallel state with one another. CONSTITUTION:Intervals among lead parts 7, 7', and 7'' led out from a sealed outer form 5' are different respectively, and are different from intervals among outer lead parts 2, 2', and 2''. The intervals among the outer lead parts 2, 2', 2'' are at constant pitches. Thus, the outer dimension of the package can be made small, which becomes advantageous in respect to mounting on a printed substrate. |
