| 摘要 |
PURPOSE:To improve moisture resistance and crack resistance of a resin-sealed type semiconductor device by sealing a semiconductor element with ultrafine particles of synthetic rubber of high molecular weight and epoxy resin which contains organopolysiloxane. CONSTITUTION:Rubber ultrafine particles of derivative having polybutadiene, polyisoprene or their hydroxyl group, carboxylic group, amino group, chiol group, isocyanate group or epoxy group (with 150mum or less in diameter) and silicone oil particularly having as substituted group methyl group, epoxy group, or hydroxyl group (dimethylpolysiloxane) are mixed in the amount of 0.1- 20pts.wt. to 100pts.wt. of epoxy resin. The epoxy resin, curing agent and cure accelerator of known materials may be widely used. Maleic anhydride, tetra- substituted phosphonium.tetra-substituted borate are, for example, added to bisphenol A. A solid material is pulverized to be sufficiently mixed. This resin is reduced in elastic modulus, has good adhesive with an element, prevents crack at the molding time, and a semiconductor device which has good moisture resistance can be formed. |
